You will have to adjust your zone temperatures and belt speed to replicate the manufacturers profile. Specific time vs temperature will be given. Some need a slow ramp to liquidus and others need a ramp to soak and a spike to liquidus. As said, start with the paste manufacturers recomendation which is usually published on the paste spec sheet. | | What oven temperature should be used to reflow solder (Sn63Pb37) on a PC board (0.075" to 0.100" thickness) in 5 to 10 minutes? | | Profiling - tedious but important. Some of the paste manufacturers and profiler manufacturers have technical bulletins as well. A search of this forum and a look through back issues of Circuits Assembly or Electronic Packaging and Production magazines will get you more info. There are several systems that ride along with the board and many ovens have built in profile monitoring. You will need some way to measure the time vs temperature and graph it. If it is too fast you will damage your components. Rate of rise and cooling are also important. trial and error and usually time after time with a board that you expect to scrap (but save it to periodically recheck your profile). | What oven temperature should be used to reflow solder (Sn63Pb37) on a PC board (0.075" to 0.100" thickness) in 5 to 10 minutes?
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